Packaging and Testing

Industry:
Packaging and Testing
Name:
IC lead frame
Content:
Glue
Product:
Industry:
Packaging and Testing
Name:
IC sheet copper frame
Content:
Distinguish if there is IC in frames
Product:
Industry:
Packaging and Testing
Name:
Memory card
Content:
Surface impurity
Product:
Industry:
Packaging and Testing
Name:
IC chip
Content:
Laser-engraving words
Product:
Industry:
Packaging and Testing
Name:
CPU chip
Content:
Word marking
Product:
Industry:
Packaging and Testing
Name:
CPU chip
Content:
Laser-engraving words
Product:
Industry:
Packaging and Testing
Name:
CPU chips
Content:
Glue leak
Product:
Industry:
Packaging and Testing
Name:
Die PAD line
Content:
PAD broken bond finger
Product:
Industry:
Packaging and Testing
Name:
IC chip box
Content:
IC quantity
Product:
Industry:
Packaging and Testing
Name:
IC tape
Content:
Defection
Product:
Industry:
Packaging and Testing
Name:
IC tape
Content:
Defection
Product:
Industry:
Packaging and Testing
Name:
IC TRAY
Content:
Check if IC has front side and back side
Product:
Industry:
Packaging and Testing
Name:
IC tape
Content:
Laser-engraving words
Product:
Industry:
Packaging and Testing
Name:
IC tape
Content:
Front side and back side
Product:
Industry:
Packaging and Testing
Name:
Chip IC
Content:
Laser-engraving words
Product:
Industry:
Packaging and Testing
Name:
IC TRAY
Content:
OCR words
Product:
Industry:
Packaging and Testing
Name:
IC
Content:
Words and circle feature targets
Product:
Industry:
Pakagng and testing
Name:
Chip
Content:
Outer defection(Glue leak)
Product:
Industry:
Packaging and Testing
Name:
Passive element
Content:
Tape OCR
Product:
Industry:
Packaging and Testing
Name:
IC TRAY
Content:
IC OCR
Product:
Industry:
Packaging and Testing
Name:
IC
Content:
Glue leaking check
Product:
Industry:
Packaging and testing
Name:
IC chip(solder balls)
Content:
Spherometer and distance measurement
Product: