• proimages/Industrial_application/C/記憶卡.png
    Industry: Packaging and Testing
    Name: Memory card
    Content: Surface impurity
    Product: GL-LDR10068R-24
  • proimages/Industrial_application/C/IC銅片框架.png
    Industry: Packaging and Testing
    Name: IC sheet copper frame
    Content: Distinguish if there is IC in frames
    Product: GL-FPQ152152W-24
  • proimages/Industrial_application/C/IC晶片.jpg
    Industry: Packaging and Testing
    Name: IC chip
    Content: Laser-engraving words
    Product: GL-LDR7448W-24
  • proimages/Industrial_application/C/CPU晶片.png
    Industry: Packaging and testing
    Name: CPU chip
    Content: Word marking
    Product: GL-IFV40W-24
  • proimages/Industrial_application/C/CUP晶片_2.png
    Industry: Packaging and testing
    Name: CPU chip
    Content: Laser-engraving words
    Product: GL-LDR7448W-24
  • proimages/Industrial_application/C/CPU晶片_溢膠.jpg
    Industry: Packaging and testing
    Name: CPU chips
    Content: Glue leak
    Product: GL-LDR7448W-24
  • proimages/Industrial_application/C/晶圓PAD線.png
    Industry: Packaging and testing
    Name: Die PAD line
    Content: PAD broken bond finger
    Product: GL-DO12292W-24
  • proimages/Industrial_application/C/IC晶片包裝盒_-_複製.png
    Industry: Packaging and testing
    Name: IC chip box
    Content: IC quantity
    Product: GL-PR136108W-24
  • proimages/Industrial_application/C/IC導線架.jpg
    Industry: Packaging and testing
    Name: IC lead frame
    Content: Glue
    Product: GL-DB6020B-24
  • proimages/Industrial_application/C/IC料帶.jpg
    Industry: Packaging and testing
    Name: IC tape
    Content: Defection
    Product: GL-IFV130W-24
  • proimages/Industrial_application/C/封裝晶線.jpg
    Industry: Packaging and testing
    Name: IC tape
    Content: Diamond particles
    Product: GL-FDR12292B-24
  • proimages/Industrial_application/C/IC_TRAY盤2.png.jpg
    Industry: Packaging and testing
    Name: IC TRAY
    Content: Check if IC has front side and back side
    Product: GL-PR136108B-24
  • proimages/Industrial_application/C/料帶IC.jpg
    Industry: Packaging and testing
    Name: IC tape
    Content: Laser-engraving words
    Product: GL-LDR7448R-24
  • proimages/Industrial_application/C/晶片.jpg
    Industry: Packaging and testing
    Name: IC tape
    Content: Front side and back side
    Product: GL-ADM90120B-24
  • proimages/Industrial_application/C/CHIP_IC.png
    Industry: Packaging and testing
    Name: Chip IC
    Content: Laser-engraving words
    Product: GL-LDR7448R-24
  • proimages/Industrial_application/C/IC_TRAY盤.png
    Industry: Packaging and testing
    Name: IC TRAY
    Content: OCR words
    Product: GL-DB11020R-24
  • proimages/Industrial_application/C/IC.2.png
    Industry: Packaging and testing 
    Product: IC
    Content: Words and circle feature targets
    Product: GL-LDR4822R-24
  • proimages/Industrial_application/C/晶片2.jpg
    Industry: Pakagng and testing
    Name: Chip
    Content: Outer defection(Glue leak)
    Product: GL-ADM6060W-24
  • proimages/Industrial_application/C/被動元件.jpg
    Industry: Packaging and testing
    Name: Passive element
    Content: Tape OCR
    Product: GL-IFV20R-24
  • proimages/Industrial_application/C/被動元件2.jpg
    Industry: Packaging and testing
    Name: IC TRAY
    Content: IC OCR
    Product: GL-DR5028R-24
  • proimages/Industrial_application/C/IC.png
    Industry: Packaging and testing
    Name: IC 
    Content: Glue leaking check
    Product: GL-DO12292R-24
  • Industry: Packaging and testing
    Name: IC chip(solder balls)
    Content: Spherometer and distance measurement
    Product: GL-PR9058R-24
I agree